Multilayer capacitor and electronic component device

ABSTRACT

A multilayer capacitor includes an element assembly, a first external electrode, a second external electrode, and a plurality of internal electrodes which are disposed at the inside of the element assembly. The plurality of internal electrodes include a first internal electrode that is electrically connected to the first external electrode, a second internal electrode that is electrically connected to the second external electrode, and a plurality of third internal electrodes. The plurality of third internal electrodes are electrically connected to each other by a first connection conductor and a second connection conductor, a first capacitance portion is constituted by the first internal electrode and the third internal electrodes, a second capacitance portion is constituted by the second internal electrode and the third internal electrodes, and the first capacitance portion and the second capacitance portion are electrically connected in series.

TECHNICAL FIELD

The present invention relates to a multilayer capacitor and anelectronic component device.

BACKGROUND

As a multilayer capacitor in the related art, for example, a multilayercapacitor described in Japanese Unexamined Patent Publication No.H7-135124 is known. The multilayer capacitor described in JapaneseUnexamined Patent Publication No. H7-135124 is a lamination-type ceramiccapacitor in which a plurality of dielectric layers with an electrodepattern disposed on a surface thereof are stacked, and a plurality ofcapacitor components which are connected in parallel are formed on aninner side. Parts of the electrode patterns arranged on the ceramicdielectric layers are divided into a plurality of pieces so that each ofthe capacitor components which are connected in parallel is formed byconnecting at least two capacitor components in series.

SUMMARY

In the multilayer capacitor of the related art, at least two capacitorcomponents are connected in series to realize an improvement in awithstand voltage property. However, in the multilayer capacitor of therelated art, for example, even in a case where a problem such asshort-circuiting occurs in one capacitor component between the capacitorcomponents which are connected in parallel, the other capacitorcomponent is not influenced by the problem. Therefore, in the multilayercapacitor of the related art, even in a case where a problem occurs inthe capacitor component, electrostatic capacitance and a withstandvoltage are secured. Accordingly, even though a problem occurs aftermounting, it is difficult to detect the problem.

An object of an aspect of the invention is to provide a multilayercapacitor and an electronic component device which are capable ofdetecting occurrence of a problem while realizing an improvement in awithstand voltage property.

According to an aspect of the invention, there is provided a multilayercapacitor including: an element assembly including a pair of endsurfaces which are opposite to each other, a pair of main surfaces whichare opposite to each other, and a pair of lateral surfaces which areopposite to each other; a first external electrode and a second externalelectrode which are respectively disposed on pair-of-end-surface sides;and a plurality of internal electrodes which are disposed in the elementassembly. The plurality of internal electrodes include a first internalelectrode that is electrically connected to the first externalelectrode, a second internal electrode that is electrically connected tothe second external electrode, and a plurality of third internalelectrodes, the plurality of third internal electrodes are electricallyconnected to each other by a connection conductor, a first capacitanceportion is constituted by the first internal electrode and the thirdinternal electrodes, a second capacitance portion is constituted by thesecond internal electrode and the third internal electrodes, and thefirst capacitance portion and the second capacitance portion areelectrically connected in series.

In the multilayer capacitor according to the aspect of the invention,the first capacitance portion is constituted by the first internalelectrode that is electrically connected to the first externalelectrode, and the third internal electrodes, and the second capacitanceportion is constituted by the second internal electrode that isconnected to the second external electrode, and the third internalelectrodes. The plurality of third internal electrodes are electricallyconnected to each other by a connection conductor. According to this,the multilayer capacitor has a configuration in which two capacitorcomponents are connected in series. Accordingly, in the multilayercapacitor, an improvement in a withstand voltage property is realized.In addition, in the multilayer capacitor, the first capacitance portionand the second capacitance portion are connected in series by theplurality of third internal electrodes which are electrically connectedto each other by the connection conductor. Accordingly, for example, ina case where a problem occurs in the first capacitance portion, avariation occurs in electrostatic capacitance and a resistance value. Asa result, in the multilayer capacitor, even when a problem occurs aftermounting, it is possible to detect the problem.

In an embodiment, the first internal electrode and the second internalelectrode may be disposed at the same position in an opposing directionof the pair of main surfaces, and the third internal electrodes may bedisposed to be respectively opposite to the first internal electrode andthe second internal electrode. In this configuration, the firstcapacitance portion is constructed in a region on one end surface side,and the second capacitance portion is constructed in a region on theother end surface side. According to this, in the multilayer capacitor,even in a case where bending occurs in the element assembly, and cracksoccur in the element assembly from main surface sides, for example, thesecond internal electrode disposed on the other end surface side may bebroken, but it is possible to avoid breakage of the first internalelectrode disposed on one end surface side. Accordingly, in themultilayer capacitor, it is possible to protect the first capacitanceportion. As described above, in the multilayer capacitor, even in a casewhere cracks occur in the element assembly, it is possible to protect apart of the capacitance portions.

When the multilayer capacitor is mounted on a circuit substrate and thelike, cracks may occur in the element assembly. The cracks may occur ina state in which the external electrode, which is disposed on a mountingsurface side of the element assembly mounted on the circuit substrate,is set as a base point. In a multilayer capacitor of the related art,two electrode patterns, which are electrically connected to externalelectrodes different from each other, are disposed on one dielectriclayer. In this configuration, in a case where cracks occur from bothsides of the two external electrodes, both of the two electrode patternsdisposed on a mounting surface side may be broken. Therefore, in themultilayer capacitor of the related art, a problem may occur in theentirety of capacitor components.

In an embodiment, the first internal electrode may be disposed on onemain surface side at the inside of the element assembly, the secondinternal electrode may be disposed on the other main surface side at theinside of the element assembly, and the third internal electrodes may bedisposed to be respectively opposite to the first internal electrode andthe second internal electrode. In this configuration, the firstcapacitance portion is constructed in a region on the one main surfaceside, and the second capacitance portion is constructed in a region onthe other main surface side. According to this, in the multilayercapacitor, in a case where the multilayer capacitor is mounted in astate in which the other main surface is set as the mounting surface,even in a case where cracks occur in the element assembly from both ofthe first external electrode side and the second external electrodeside, the second internal electrode may be broken, but it is possible toavoid breakage of the first internal electrode disposed on the one mainsurface side. Accordingly, in the multilayer capacitor, it is possibleto protect the first capacitance portion. As described above, in themultilayer capacitor, even in a case where cracks occur in the elementassembly, it is possible to protect a part of the capacitance portions.

In an embodiment, a pair of the third internal electrodes may bedisposed to be opposite to each other between the first internalelectrode and the second internal electrode. In this configuration, acapacitance portion is not formed between the first capacitance portionand the second capacitance portion. Accordingly, it is possible toeasily realize a configuration in which the first capacitance portionand the second capacitance portion are electrically connected in series.

In an embodiment, the third internal electrodes may be further disposedbetween the pair of third internal electrodes disposed to be opposite toeach other. In this configuration, for example, even in a case wherebreakage occurs in the first internal electrode that constitutes thefirst capacitance portion, it is possible to suppress the breakage frompropagating to the second internal electrode that constitutes the secondcapacitance portion due to the third internal electrodes. As a result,in the multilayer capacitor, even in a case where cracks occur in theelement assembly, it is possible to protect a part of the capacitanceportions.

In an embodiment, the multilayer capacitor may include a dummy electrodethat is disposed at the same layer as a layer of at least one internalelectrode among the first internal electrode, the second internalelectrode, and the third internal electrodes to be spaced away from theinternal electrode, and is connected to an external electrode differentfrom the first external electrode or the second external electrode towhich the internal electrode is connected. In this configuration, theexternal electrodes and the dummy electrode are joined to each other, itis possible to secure joining strength between the element assembly, andthe first external electrode and/or the second external electrode.

In an embodiment, the first capacitance portion may be constituted bythe first internal electrode and the third internal electrodes which aredisposed in a region on the one main surface side at the inside of theelement assembly, the second capacitance portion may be constituted bythe second internal electrode and the third internal electrodes whichare disposed in a region on the other main surface side at the inside ofthe element assembly, an isolation portion may be provided between thefirst capacitance portion and the second capacitance portion in theopposing direction of the pair of main surfaces to isolate the firstcapacitance portion and the second capacitance portion, and electricfield intensity at the isolation portion may be smaller than electricfield intensity of the first internal electrode and the third internalelectrodes at the first capacitance portion, and electric fieldintensity of the second internal electrode and the third internalelectrodes at the second capacitance portion. In this configuration, itis possible to further suppress occurrence of insulating breakage andthe like between the first capacitance portion and the secondcapacitance portion. As a result, in the multilayer capacitor, it ispossible to further realize an improvement in the withstand voltageproperty.

In an embodiment, the isolation portion may be disposed between the pairof third internal electrodes which are opposite to each other in theopposing direction. In this configuration, since the isolation portionis provided between the third internal electrodes which are electricallyconnected to each other, it is possible to set electric field intensityat the isolation portion to zero. Accordingly, it is possible to furthersuppress occurrence of insulating breakage and the like between thefirst capacitance portion and the second capacitance portion. As aresult, it is possible to further realize an improvement in thewithstand voltage property.

In an embodiment, the other main surface of the element assembly may bea mounting surface, the connection conductor may be disposed onpair-of-lateral-surface sides of the element assembly, each of the firstexternal electrode, the second external electrode, and the connectionconductor may include an electrode portion that is disposed on themounting surface, and the thickness of the electrode portion of theconnection conductor in the opposing direction may be smaller than thethickness of the electrode portion of each of the first externalelectrode and the second external electrode in the opposing direction.In this configuration, when the multilayer capacitor is mounted on acircuit substrate and the like, the thickness of the electrode portionof the first external electrode and the second external electrode islarge, and thus it is possible to suppress the electrode portion of theconnection conductor from coining into contact with the circuitsubstrate and the like. Accordingly, it is possible to suppress thefirst external electrode and/or the second external electrode and theconnection conductor from being electrically connected to each other. Asa result, in the multilayer capacitor according to the embodiment, it ispossible to realize a configuration in which the first capacitanceportion and the second capacitance portion are connected in series.

In an embodiment, when a distance between an edge, which is located onan inner side in an opposing direction of the pair of end surfaces, ofthe electrode portion of each of the first external electrode and thesecond external electrode, and an end surface, on which the firstexternal electrode or the second external electrode that includes theelectrode portion is disposed, in the pair of end surfaces is set as BL,and a distance between the mounting surface and the first capacitanceportion is set as GL, a relationship of BL<GL×0.36 may be satisfied. Ina case of mounting the multilayer capacitor on a circuit substrate andthe like, when the circuit substrate is bent, cracks may occur in theelement assembly from a position corresponding to the edge of theelectrode portion of the first external electrode and/or the secondexternal electrode. The cracks may occur at a predetermined angle fromthe position corresponding to the edge of the electrode portion. In themultilayer capacitor according to the embodiment, the relationship ofBL<GL×0.36 is satisfied. Accordingly, even in a case where cracks occurin the element assembly, it is possible to suppress the cracks fromreaching the first capacitance portion. Accordingly, it is possible tosuppress the cracks from having an effect on the first capacitanceportion. As a result, in the multilayer capacitor according to theembodiment, even in a case where cracks occur in the element assembly,it is possible to protect a part of the capacitance portions.

According to another aspect of the invention, there is provided anelectronic component device including: a circuit substrate including anelectrical circuit; and a multilayer capacitor that is mounted on thecircuit substrate. The multilayer capacitor includes an element assemblyincluding a pair of end surfaces which are opposite to each other, apair of main surfaces which are opposite to each other, and a pair oflateral surfaces which are opposite to each other, a first externalelectrode and a second external electrode which are respectivelydisposed on pair-of-end-surface sides, and a plurality of internalelectrodes which are disposed in the element assembly. The plurality ofinternal electrodes include a first internal electrode that iselectrically connected to the first external electrode, a secondinternal electrode that is electrically connected to the second externalelectrode, and a plurality of third internal electrodes, the pluralityof third internal electrodes are electrically connected to each other bya connection conductor, a first capacitance portion is constituted bythe first internal electrode and the third internal electrodes, a secondcapacitance portion is constituted by the second internal electrode andthe third internal electrodes, only the first external electrode and thesecond external electrode of the multilayer capacitor are electricallyconnected to the electrical circuit of the circuit substrate, and in themultilayer capacitor, the first capacitance portion and the secondcapacitance portion are electrically connected in series.

In the electronic component device according to the aspect of theinvention, only the first external electrode and the second externalelectrode of the multilayer capacitor are electrically connected to theelectrical circuit of the circuit substrate. According to the electroniccomponent device, in the multilayer capacitor, the first capacitanceportion is constituted by the first internal electrode that iselectrically connected to the first external electrode, and the thirdinternal electrodes, and the second capacitance portion is constitutedby the second internal electrode that is connected to the secondexternal electrode, and the third internal electrodes. The plurality ofthird internal electrodes are electrically connected to each other bythe connection conductor. According to this, the multilayer capacitorhas a configuration in which two capacitor components are connected inseries. Accordingly, in the multilayer capacitor, an improvement in awithstand voltage property is realized. In addition, in the multilayercapacitor, the first capacitance portion and the second capacitanceportion are connected in series by the plurality of third internalelectrodes which are electrically connected to each other by theconnection conductor. Accordingly, for example, in a case where aproblem occurs in the first capacitance portion, a variation occurs inelectrostatic capacitance and a resistance value. Accordingly, in themultilayer capacitor, even when a problem occurs after mounting, it ispossible to detect the problem. As a result, in the electronic componentdevice including the multilayer capacitor, it is possible to detectoccurrence of a problem while realizing an improvement in the withstandvoltage property.

In an embodiment, between one main surface and the other main surface ofthe element assembly, the other main surface may be a mounting surface,the connection conductor may be disposed at least on one lateral surfaceside of the element assembly, each of the first external electrode, thesecond external electrode, and the connection conductor may include anelectrode portion that is disposed on the mounting surface, and thethickness of the electrode portion of each of the first externalelectrode and the second external electrode in an opposing direction ofthe pair of main surfaces may be greater than the thickness of theelectrode portion of the connection conductor in the opposing direction.In this configuration, it is possible to avoid a situation in which theelectrode portion of the connection conductor comes into contact withthe circuit substrate prior to the electrode portion of the firstexternal electrode and the second external electrode. Accordingly, inthe electronic component device, it is possible to stably mount thefirst external electrode and the second external electrode of themultilayer capacitor on the circuit substrate.

In an embodiment, between one main surface and the other main surface ofthe element assembly, the other main surface may be a mounting surface,and the connection conductor may be disposed at least on one lateralsurface side of the element assembly. In this configuration, theconnection conductor is not disposed on the main surface that is themounting surface. According to this, in the electronic component device,it is possible to avoid a situation in which the connection conductorcomes into contact with the circuit substrate on the mounting surface.Accordingly, in the electronic component device, it is possible tostably mount the first external electrode and the second externalelectrode of the multilayer capacitor on the circuit substrate. Inaddition, in the electronic component device, it is possible to suppressshort-circuiting from occurring between the first external electrodeand/or the second external electrode, and the connection conductor.

In an embodiment, the connection conductor may be a via-conductor thatis disposed at the inside of the element assembly. In thisconfiguration, the connection conductor is not exposed from the elementassembly. According to this, in the electronic component device, it ispossible to avoid a situation in which the connection conductor comesinto contact with the circuit substrate. Accordingly, in the electroniccomponent device, it is possible to stably mount the first externalelectrode and the second external electrode of the multilayer capacitoron the circuit substrate. In addition, in the electronic componentdevice, it is possible to suppress short-circuiting from occurringbetween the first external electrode and/or the second externalelectrode, and the connection conductor.

In an embodiment, the first internal electrode and the second internalelectrode may be disposed at the same position in an opposing directionof the pair of main surfaces, and the third internal electrodes may bedisposed to be respectively opposite to the first internal electrode andthe second internal electrode. In this configuration, the firstcapacitance portion is constructed in a region on one end surface side,and the second capacitance portion is constructed in a region on theother end surface side. According to this, in the multilayer capacitor,even when bending occurs in the element assembly, and cracks occur inthe element assembly, for example, the second internal electrodedisposed on the other end surface side may be broken, but it is possibleto avoid breakage of the first internal electrode disposed on the oneend surface side. Accordingly, in the multilayer capacitor, it ispossible to protect the first capacitance portion. As described above,in the multilayer capacitor, even in a case where cracks occur in theelement assembly, it is possible to protect a part of the capacitanceportions.

In an embodiment, the first internal electrode may be disposed on onemain surface side at the inside of the element assembly, the secondinternal electrode may be disposed on the other main surface side at theinside of the element assembly, and the third internal electrodes may bedisposed to be respectively opposite to the first internal electrode andthe second internal electrode. In this configuration, the firstcapacitance portion is constructed in a region on one main surface side,and the second capacitance portion is constructed in a region on theother main surface side. According to this, in a case where themultilayer capacitor is mounted in a state in which the other mainsurface is set as a mounting surface, even in a case where cracks occurin the element assembly from both of the first external electrode sideand the second external electrode side, the second internal electrodemay be broken, but it is possible to avoid breakage of the firstinternal electrode disposed on the one main surface side. Accordingly,in the multilayer capacitor, it is possible to protect the firstcapacitance portion. As described above, in the multilayer capacitor,even in a case where cracks occur in the element assembly, it ispossible to protect a part of the capacitance portions.

According to the aspect of the invention, it is possible to detectoccurrence of a problem while realizing an improvement in the withstandvoltage property.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 is a view illustrating an electronic component device accordingto an embodiment;

FIG. 2 is a perspective view illustrating a multilayer capacitoraccording to a first embodiment;

FIG. 3 is a view illustrating a cross-sectional configuration of themultilayer capacitor illustrated in FIG. 2;

FIG. 4A is a view illustrating a cross-sectional configuration of themultilayer capacitor illustrated in FIG. 2;

FIG. 4B is a view illustrating a cross-sectional configuration of themultilayer capacitor illustrated in FIG. 2;

FIG. 5 is an exploded perspective view of an element assembly of themultilayer capacitor illustrated in FIG. 2;

FIG. 6 is a view illustrating a cross-sectional configuration of themultilayer capacitor illustrated in FIG. 2;

FIG. 7 is an equivalent circuit diagram of the multilayer capacitorillustrated in FIG. 2;

FIG. 8A is a view illustrating a circuit substrate of the electroniccomponent device illustrated in FIG. 1;

FIG. 8B is a view illustrating a state in which the multilayer capacitoris mounted on the circuit substrate;

FIG. 9A is a view illustrating a circuit substrate of an electroniccomponent device according to a modification example;

FIG. 9B is a view illustrating a state in which the multilayer capacitoris mounted on the circuit substrate;

FIG. 10 is a view illustrating a cross-sectional configuration of amultilayer capacitor according to a modification example of the firstembodiment;

FIG. 11 is a view illustrating a cross-sectional configuration of themultilayer capacitor according to a modification example of the firstembodiment;

FIG. 12 is a view illustrating a cross-sectional configuration of themultilayer capacitor according to a modification example of the firstembodiment;

FIG. 13A is a perspective view illustrating a multilayer capacitoraccording to a modification example of the first embodiment;

FIG. 13B is a view illustrating a cross-sectional configuration of themultilayer capacitor in FIG. 13A.

FIG. 14A is a perspective view illustrating a multilayer capacitoraccording to a modification example of the first embodiment;

FIG. 14B is a view illustrating a cross-sectional configuration of themultilayer capacitor in FIG. 14A;

FIG. 15 is a view illustrating a cross-sectional configuration of amultilayer capacitor according to a second embodiment;

FIG. 16 is an exploded perspective view of an element assembly of themultilayer capacitor illustrated in FIG. 15;

FIG. 17 is an equivalent circuit diagram of the multilayer capacitorillustrated in FIG. 15;

FIG. 18A is a perspective view illustrating a multilayer capacitoraccording to a modification example of the second embodiment;

FIG. 18B is a view illustrating a cross-sectional configuration of themultilayer capacitor illustrated in FIG. 18A;

FIG. 19 is a view illustrating a cross-sectional configuration of amultilayer capacitor according to a third embodiment; and

FIG. 20 is a view illustrating a cross-sectional configuration of amultilayer capacitor according to a modification example of the thirdembodiment.

DETAILED DESCRIPTION

Hereinafter, embodiments of the invention will be described in detailwith reference to the accompanying drawings. Furthermore, in descriptionof the drawings, the same reference numeral will be given to the sameelement or an equivalent element, and redundant description thereof willnot be repeated.

As illustrated in FIG. 1, an electronic component device 110 includes amultilayer capacitor 1 and a circuit substrate 100.

First Embodiment

As illustrated in FIG. 2, FIG. 3, FIG. 4A, and FIG. 4B, the multilayercapacitor 1 according to the first embodiment includes an elementassembly 2, a first external electrode 3, a second external electrode 4,a first connection conductor 5, and a second connection conductor 6which are disposed on an outer surface of the element assembly 2.

The element assembly 2 has a rectangular parallelepiped shape. Therectangular parallelepiped shape includes a shape of a rectangularparallelepiped in which respective corners and ridgeline portions arechamfered, and a shape of a rectangular parallelepiped in whichrespective corners and ridgeline portions are rounded. The elementassembly 2 includes a pair of end surfaces 2 a and 2 b which areopposite to each other, a pair of main surfaces 2 c and 2 d which areopposite to each other, and a pair of lateral surfaces 2 e and 2 f whichare opposite to each other as outer surfaces thereof. An opposingdirection in which the main surfaces 2 c and 2 d as a pair are oppositeto each other is a first direction D1. An opposing direction in whichthe end surfaces 2 a and 2 b as a pair are opposite to each other is asecond direction D2. An opposing direction in which the lateral surface2 e and 2 f as a pair are opposite to each other is a third directionD3. In this embodiment, the first direction D1 is a height direction ofthe element assembly 2. The second direction D2 is a longitudinaldirection of the element assembly 2, and is perpendicular to the firstdirection D1. The third direction D3 is a width direction of the elementassembly 2 and is perpendicular to the first direction D1 and the seconddirection D2.

The pair of end surfaces 2 a and 2 b extend in the first direction D1 toconnect the pair of main surfaces 2 c and 2 d. The pair of end surfaces2 a and 2 b also extend in the third direction D3 (a short-sidedirection of the pair of main surfaces 2 c and 2 d). The pair of lateralsurfaces 2 e and 2 f extends in the first direction D1 to connect thepair of main surfaces 2 c and 2 d. The pair of lateral surfaces 2 e and2 f also extend in the second direction D2 (a long-side direction of thepair of end surfaces 2 a and 2 b). In this embodiment, as illustrated inFIG. 8B, the main surface 2 d is defined as a mounting surface that isopposite to another electronic device when the multilayer capacitor 1 ismounted on the other electronic device (for example, a circuitsubstrate, a multilayer capacitor, and the like).

As illustrated in FIG. 5, the element assembly 2 has a configuration inwhich a plurality of dielectric layers (insulating layers) 10 arelaminated in the direction in which the main surfaces 2 c and 2 d as apair are opposite to each other. In the element assembly 2, thelamination direction of the plurality of dielectric layers 10(hereinafter, simply referred to as “lamination direction”) matches thefirst direction D1. For example, the dielectric layers 10 areconstituted by a sintered body of a ceramic green sheet including adielectric material (dielectric ceramic such as a BaTiO₃-baseddielectric ceramic, a Ba(Ti, Zr)O₃-based dielectric ceramic, or a (Ba,Ca)TiO₃-based dielectric ceramic). In an actual element assembly 2, thedielectric layers 10 are integrally formed to a certain extent at whicha boundary between the dielectric layers 10 is not visually recognized.

As illustrated in FIG. 3, FIG. 4A, and FIG. 4B, the multilayer capacitor1 includes a plurality of first internal electrodes 12, a plurality offirst dummy electrodes 13, a plurality of second internal electrodes 14,a plurality of second dummy electrodes 15, and a plurality of thirdinternal electrodes 16 as internal conductors which are disposed in theelement assembly 2. In this embodiment, the number (here, three) of theplurality of first internal electrodes 12 is the same as the number ofthe plurality of second internal electrodes 14.

The plurality of first internal electrodes 12, the plurality of firstdummy electrodes 13, the plurality of second internal electrodes 14, theplurality of second dummy electrodes 15, and the plurality of thirdinternal electrodes 16 are constituted by a conductive material (forexample, Ni, Cu, and the like) that is typically used as an internalelectrode of a lamination-type electrical element. The plurality offirst internal electrodes 12, the plurality of first dummy electrodes13, the plurality of second internal electrodes 14, the plurality ofsecond dummy electrodes 15, and the plurality of third internalelectrodes 16 are constituted by a sintered body of conductive pasteincluding the conductive material.

The first internal electrodes 12, the second internal electrodes 14, andthe third internal electrodes 16 are disposed at positions (layers)different from each other in the first direction D1 of the elementassembly 2. The first internal electrodes 12 and the third internalelectrodes 16 are alternately disposed to be opposite to each other atan interval in the first direction D1 at the inside of the elementassembly 2. The second internal electrodes 14 and the third internalelectrodes 16 are alternately disposed to be opposite to each other atan interval in the first direction D1 at the inside of the elementassembly 2. The first internal electrodes 12 and the first dummyelectrodes 13 are disposed at the same position (layer) at the inside ofthe element assembly 2. The second internal electrodes 14 and the seconddummy electrodes 15 are disposed at the same position (layer) at theinside of the element assembly 2.

As illustrated in FIG. 3, FIG. 4A, and FIG. 4B, the plurality of firstinternal electrodes 12 are disposed in a region on the one main surface2 c side in the first direction D1 of the element assembly 2. In thisembodiment, the plurality of first internal electrodes 12 are disposedin a region on the one main surface 2 c side of the element assembly 2in comparison to the central portion of the element assembly 2 in thefirst direction D1.

As illustrated in FIG. 5, the first internal electrodes 12 have arectangular shape in which the second direction D2 is set as a long-sidedirection, and the third direction D3 is set as a short-side direction.One end of the first internal electrodes 12 in the longitudinaldirection is exposed to one end surface 2 a. The other end of the firstinternal electrodes 12 in the longitudinal direction is located on theone end surface 2 a side in comparison to the other end surface 2 b, andis spaced away from the other end surface 2 b. The first internalelectrodes 12 are not exposed to the other end surface 2 b, the pair ofmain surfaces 2 c and 2 d, and the pair of lateral surfaces 2 e and 2 f.In the first internal electrodes 12, the end exposed to the one endsurface 2 a is electrically connected to the first external electrode 3.

The first dummy electrodes 13 have rectangular shapes in which thesecond direction D2 is set as a lateral direction and the thirddirection D3 is set as a longitudinal direction. One end of the firstdummy electrodes 13 in the lateral direction is exposed at the other endsurface 2 b. The other end of the first dummy electrodes 13 in thelateral direction is located on the other end surface 2 b side incomparison to the one end surface 2 a, and is spaced away from the oneend surface 2 a. The first internal electrodes 12 and the first dummyelectrodes 13 are disposed at a predetermined interval in the seconddirection D2 (are electrically insulated). In the first dummy electrodes13, the end exposed to the other end surface 2 b is electricallyconnected to the second external electrode 4.

As illustrated in FIG. 3, FIG. 4A, and FIG. 4B, the plurality of secondinternal electrodes 14 are disposed in a region on the other mainsurface 2 d side in the first direction D1 of the element assembly 2. Inthis embodiment, the plurality of second internal electrodes 14 aredisposed in a region on the other main surface 2 d side of the elementassembly 2 in comparison to the central portion of the element assembly2 in the first direction D1.

As illustrated in FIG. 5, the second internal electrodes 14 haverectangular shapes in which the second direction D2 is set as along-side direction and the third direction D3 is set as a short-sidedirection. One end of the second internal electrodes 14 is exposed tothe other end surface 2 b. The other end of the second internalelectrodes 14 in the longitudinal direction is located on the other endsurface 2 b side in comparison to the one end surface 2 b, and is spacedaway from the one end surface 2 a. The second internal electrodes 14 arenot exposed to the one end surface 2 a, the pair of main surfaces 2 cand 2 d, and the pair of lateral surfaces 2 e and 2 f. In the secondinternal electrodes 14, the end exposed to the other end surface 2 b iselectrically connected to the second external electrode 4.

The second dummy electrodes 15 have rectangular shapes in which thesecond direction D2 is set as a lateral direction and the thirddirection D3 is set as a longitudinal direction. One end of the seconddummy electrodes 15 in the lateral direction is exposed to the one endsurface 2 a. The other end of the second dummy electrodes 15 in thelateral direction is located on the one end surface 2 a side incomparison to the other end surface 2 b, and is spaced away from theother end surface 2 b. The second internal electrodes 14 and the seconddummy electrodes 15 are disposed at a predetermined interval in thesecond direction D2. In the second dummy electrodes 15, the end exposedto the one end surface 2 a is electrically connected to the firstexternal electrode 3.

Each of the third internal electrodes 16 includes a main electrodeportion 16 a and connection portions 16 b and 16 c. The main electrodeportions 16 a are opposite to each of the first internal electrodes 12or each of the second internal electrodes 14 in the first direction D1through a part (dielectric layer 10) of the element assembly 2. The mainelectrode portion 16 a has a rectangular shape in which the seconddirection D2 is set as a long-side direction and the third direction D3is set as a short-side direction. The connection portion 16 b extendsfrom one side (one long side) of the main electrode portion 16 a and isexposed to the one lateral surface 2 e. The connection portion 16 cextends from one side (the other long side) of the main electrodeportion 16 a and is exposed to the other lateral surface 2 f. The thirdinternal electrodes 16 are exposed to the pair of lateral surfaces 2 eand 2 f, and are not exposed to the pair of end surfaces 2 a and 2 b andthe pair of main surfaces 2 c and 2 d. The main electrode portion 16 aand the connection portions 16 b and 16 c are integrally formed.

As illustrated in FIG. 2, the first external electrode 3 is disposed onthe one end surface 2 a side. The first external electrode 3 includes anelectrode portion 3 a that is disposed on the end surface 2 a, electrodeportions 3 b and 3 c which are respectively disposed on the pair of mainsurfaces 2 c and 2 d, and electrode portions 3 d and 3 e which arerespectively disposed on the pair of lateral surfaces 2 e and 2 f. Theelectrode portion 3 a, and the electrode portions 3 b, 3 c, 3 d, and 3 eare connected at a ridgeline portion of the element assembly 2, and areelectrically connected to each other. The first external electrode 3 isformed on five surfaces including the one end surface 2 a, the pair ofmain surfaces 2 c and 2 d, and the pair of lateral surfaces 2 e and 2 f.The electrode portion 3 a is disposed to cover the portion, which isexposed to the end surface 2 a, of the first internal electrodes 12, andthe portion, which is exposed to the end surface 2 a, of the seconddummy electrodes 15. The first internal electrodes 12 and the seconddummy electrodes 15 are directly connected to the first externalelectrode 3.

The second external electrode 4 is disposed on the other end surface 2 bside. The second external electrode 4 includes an electrode portion 4 athat is disposed on the end surface 2 b, electrode portions 4 b and 4 cwhich are respectively disposed on the pair of main surfaces 2 c and 2d, and electrode portions 4 d and 4 e which are respectively disposed onthe pair of lateral surfaces 2 e and 2 f. The electrode portion 4 a, andthe electrode portions 4 b, 4 c, 4 d, and 4 e are connected at aridgeline portion of the element assembly 2, and are electricallyconnected to each other. The second external electrode 4 is formed onfive surfaces including the one end surface 2 b, the pair of mainsurfaces 2 c and 2 d, and the pair of lateral surfaces 2 e and 2 f. Theelectrode portion 4 a is disposed to cover the portion, which is exposedto the end surface 2 b, of the second internal electrodes 14, and theportion, which is exposed to the end surface 2 b, of the first dummyelectrodes 13, and the second internal electrodes 14 and the first dummyelectrodes 13 are directly connected to the second external electrode 4.

On the one lateral surface 2 e side, the first connection conductor 5 isdisposed at the central portion in the second direction D2. The firstconnection conductor 5 includes an electrode portion 5 a that isdisposed on the lateral surface 2 e side, and electrode portions 5 b and5 c which are respectively disposed on the pair of main surfaces 2 c and2 d. The electrode portion 5 a, the electrode portion 5 b, and theelectrode portion 5 c are connected at a ridgeline portion of theelement assembly 2, and are electrically connected to each other. Thefirst connection conductor 5 is formed on three surfaces including thepair of main surfaces 2 c and 2 d, and the one lateral surface 2 e.

The electrode portion 5 a is disposed to cover a portion, which isexposed to the lateral surface 2 e, of the connection portion 16 b ofthe third internal electrodes 16, and the connection portion 16 b isdirectly connected to the first connection conductor 5. That is, theconnection portion 16 b connects the main electrode portion 16 a and theelectrode portion 5 a. According to this, the third internal electrodes16 are electrically connected to the first connection conductor 5.

On the other lateral surface 2 f side, the second connection conductor 6is disposed at the central portion in the second direction D2. Thesecond connection conductor 6 includes an electrode portion 6 a that isdisposed on the lateral surface 2 f side, and electrode portions 6 b and6 c which are respectively disposed on the pair of main surfaces 2 c and2 d. The electrode portion 6 a, the electrode portion 6 b, and theelectrode portion 6 c are connected at a ridgeline portion of theelement assembly 2, and are electrically connected to each other. Thesecond connection conductor 6 is formed on three surfaces including thepair of main surfaces 2 c and 2 d and the one lateral surface 2 f.

The electrode portion 6 a is disposed to cover a portion, which isexposed to the lateral surface 2 e, of the connection portion 16 c ofthe third internal electrodes 16, and the connection portion 16 c isdirectly connected to the second connection conductor 6. That is, theconnection portion 16 c connects the main electrode portion 16 a and theelectrode portion 6 a. According to this, the third internal electrodes16 are electrically connected to the second connection conductor 6.

As illustrated in FIG. 4A, the thickness T2 of the electrode portion 3c, which is disposed on the main surface 2 d of the element assembly 2,of the first external electrode 3, in the first direction D1, and thethickness T3 of the electrode portion 4 c of the second externalelectrode 4 in the first direction D1 are approximately the same as eachother. The thickness T1 of the electrode portion 5 c of the firstconnection conductor 5 in the first direction D1 is smaller than thethickness T2 of the electrode portion 3 c of the first externalelectrode 3 and the thickness T3 of the electrode portion 4 c of thesecond external electrode 4 (T1<T2, T3). As illustrated in FIG. 4B, thethickness T4 of the electrode portion 6 c, which is disposed on the mainsurface 2 d of the element assembly 2, of the second connectionconductor 6 in the first direction D1 is smaller than the thickness T2of the electrode portion 3 c of the first external electrode 3 and thethickness T3 of the electrode portion 4 c of the second externalelectrode 4 (T4<T2, T3). The thickness T1 of the electrode portion 5 cof the first connection conductor 5 and the thickness T4 of theelectrode portion 6 c of the second connection conductor 6 areapproximately the same as each other (T1=T4).

As illustrated in FIG. 6 and FIG. 7, the multilayer capacitor 1 includesa first capacitance portion C1 and a second capacitance portion C2. Asillustrated in FIG. 6, the first capacitance portion C1 is constitutedby the first internal electrodes 12 and the third internal electrodes 16which are alternately disposed to be opposite to each other at aninterval in the first direction D1 at the inside of the element assembly2. In this embodiment, the first capacitance portion C1 is constitutedby a region on the one main surface 2 c side of the element assembly 2in comparison to the central portion of the element assembly 2 in thefirst direction D1. The first capacitance portion C1 constitutes a firstcapacitor component.

The second capacitance portion C2 is constituted by the second internalelectrodes 14 and the third internal electrodes 16 which are alternatelydisposed to be opposite to each other at an interval in the firstdirection D1 at the inside of the element assembly 2. In thisembodiment, the second capacitance portion C2 is constituted by a regionon the other main surface 2 d side of the element assembly 2 incomparison to the central portion of the element assembly 2 in the firstdirection D1. The second capacitance portion C2 constitutes a secondcapacitor component.

As illustrated in FIG. 7, in the multilayer capacitor 1 having theabove-described configuration, a plurality of the first capacitanceportions C1 are electrically connected in parallel, and a plurality ofthe second capacitance portions C2 are electrically connected inparallel. In the multilayer capacitor 1, the first capacitance portionC1 and the second capacitance portion C2 are electrically connected inseries. Specifically, the first capacitance portions C1 and the secondcapacitance portions C2 are electrically connected in series by theplurality of third internal electrodes 16 which are electricallyconnected to each other by the first connection conductor 5 and thesecond connection conductor 6. Furthermore, it is not necessary for thenumber of the first capacitance portions C1 and the second capacitanceportions C2 as illustrated in FIG. 7 to be the same as the number of thefirst internal electrodes 12, the second internal electrodes 14, and thethird internal electrodes 16 as illustrated in FIG. 3.

As illustrated in FIG. 1, the circuit substrate 100 includes a powersupply 120 and an electronic control unit (ECU) 130. The power supply120 and the ECU 130 constitute an electronic circuit. In addition, asillustrated in FIG. 8A and FIG. 8B, the circuit substrate 100 includes asubstrate ST and land electrodes L1 and L2 which are mounted on thesubstrate ST. The substrate ST is provided with interconnections E1 andE2 which are electrically connected to the land electrodes L1 and L2.The interconnections E1 and E2 are electrically connected to the powersupply 120 and the ECU 130.

As illustrated in FIG. 8B, in the electronic component device 110, themain surface 2 d (mounting surface) of the element assembly 2 of themultilayer capacitor 1 is downwardly located, the electrode portion 3 cof the first external electrode 3 and the land electrode L1 are disposedto be opposite to each other, and the electrode portion 4 c of thesecond external electrode 4 and the land electrode L2 are disposed to beopposite to each other. The first external electrode 3 and the landelectrode L1 are joined to each other with solder S1, and the secondexternal electrode 4 and the land electrode L2 are joined to each otherwith solder S2. According to this, in the electronic component device110, the first external electrode 3 of the multilayer capacitor 1 andthe land electrode L1 are electrically connected to each other, and thesecond external electrode 4 and the land electrode L2 are electricallyconnected to each other. That is, in the electronic component device110, only the first external electrode 3 and the second externalelectrode 4 of the multilayer capacitor 1 are electrically connected tothe electronic circuit (the power supply 120 and the ECU 130) throughthe interconnections E1 and E2. In the electronic component device 110,the first connection conductor 5 and the second connection conductor 6are not electrically connected to the electronic circuit of the circuitsubstrate 100.

As described above, in the multilayer capacitor 1 of the electroniccomponent device 110 according to this embodiment, only the firstexternal electrode 3 and the second external electrode 4 of themultilayer capacitor 1 are electrically connected to the electricalcircuit of the circuit substrate 100. In the multilayer capacitor 1, thefirst capacitance portion C1 is constituted by the first internalelectrodes 12 which are electrically connected to the first externalelectrode 3, and the third internal electrodes 16, and the secondcapacitance portion C2 is constituted by the second internal electrodes14 which are connected to the second external electrode 4, and the thirdinternal electrodes 16. The plurality of third internal electrodes 16are electrically connected to each other by the first connectionconductor 5 and the second connection conductor 6. According to this,the multilayer capacitor 1 has a configuration in which the firstcapacitance portion C1 and the second capacitance portion C2 (twocapacitor components) are connected in series. Accordingly, in themultilayer capacitor 1, an improvement in a withstand voltage propertyis realized.

In addition, in the multilayer capacitor 1, since the first capacitanceportion C1 and the second capacitance portion C2 are connected in seriesby the plurality of third internal electrodes 16 which are electricallyconnected to each other by the first connection conductor 5 and thesecond connection conductor 6, for example, in a case where a problemoccurs in the first capacitance portion C1, a variation occurs inelectrostatic capacitance and a resistance value. According to this, inthe multilayer capacitor 1, even though a problem occurs after mounting,it is possible to detect the problem. As a result, in the electroniccomponent device 110 including the multilayer capacitor 1, it ispossible to detect occurrence of a problem while realizing animprovement in a withstand voltage property.

In addition, in the multilayer capacitor 1, as illustrated in FIG. 7, itis possible to realize a configuration in which the first capacitanceportion C1 and the second capacitance portion C2 (two capacitorcomponents) are connected in series with one multilayer capacitor (withone chip). Accordingly, in the multilayer capacitor 1, it is possible torealize safety design (design capable of detecting occurrence of aproblem while realizing an improvement in a withstand voltage property)with one chip.

In the multilayer capacitor 1 of the electronic component device 110according to this embodiment, the first internal electrodes 12 aredisposed in a region on the one main surface 2 c side at the inside ofthe element assembly 2, and the second internal electrodes 14 aredisposed in a region on the other main surface 2 d side at the inside ofthe element assembly 2. According to this, in the multilayer capacitor1, the first capacitance portion C1 is constructed in the region on theone main surface 2 c side, and the second capacitance portion C2 isconstructed in the region on the other main surface 2 d side. Accordingto this, in a case where the multilayer capacitor 1 is mounted in astate in which the other main surface 2 d is set as a mounting surface,even in a case where cracks occur in the element assembly 2 from both ofthe first external electrode 3 side and the second external electrode 4side, the second internal electrodes 14 may be broken, but it ispossible to avoid breakage of the first internal electrodes 12 disposedon the one main surface 2 c side. Accordingly, in the multilayercapacitor 1, it is possible to protect the first capacitance portion C1.As described above, in the multilayer capacitor 1, even in a case wherecracks occur in the element assembly 2, it is possible to protect a partof the capacitance portions.

In the multilayer capacitor 1 of the electronic component device 110according to this embodiment, the main surface 2 d of the elementassembly 2 is a mounting surface. The multilayer capacitor 1 includesthe first connection conductor 5 and the second connection conductor 6which are electrically connected to the plurality of third internalelectrodes 16. The first external electrode 3, the second externalelectrode 4, the first connection conductor 5, and the second connectionconductor 6 respectively include the electrode portions 3 c, 4 c, 5 c,and 6 c which are disposed on the mounting surface. The thicknesses T2and T3 (refer to FIG. 4A and FIG. 4B) of the electrode portions 3 c and4 c of the first external electrode 3 and the second external electrode4 in the first direction D1 are greater than the thicknesses T1 and T4of the electrode portions 5 c and 6 c of the first connection conductor5 and the second connection conductor 6 in the first direction D1. Inthis configuration, it is possible to stably mount the first externalelectrode 3 and the second external electrode 4 of the multilayercapacitor 1 on the circuit substrate 100.

In addition, in the configuration, since the thicknesses T1 and T4 ofthe electrode portions 5 c and 6 c of the first connection conductor 5and second connection conductor 6 are smaller than the thicknesses T2and T3 of the electrode portions 3 c and 4 c of the first externalelectrode 3 and the second external electrode 4, when the multilayercapacitor 1 is mounted on the circuit substrate 100, it is possible tosuppress the first connection conductor 5 and the second connectionconductor 6 from coining into contact with the circuit substrate 100.Accordingly, it is possible to suppress the first external electrode 3and/or the second external electrode 4 from being electrically connectedto the first connection conductor 5 and the second connection conductor6. As a result, in the multilayer capacitor 1, the first capacitanceportion C1 and the second capacitance portion C2 can be connected inseries.

The multilayer capacitor 1 of the electronic component device 110according to this embodiment includes the first dummy electrodes 13which are disposed to be spaced away from the first internal electrodes12 at the same layer as in the first internal electrodes 12, and areconnected to the second external electrode 4 different from the firstexternal electrode 3 to which the first internal electrodes 12 areconnected. In addition, the multilayer capacitor 1 includes the seconddummy electrodes 15 which are disposed to be spaced from the secondinternal electrodes 14 at the same layer as in the second internalelectrodes 14, and are connected to the first external electrode 3different from the second external electrode 4 to which the secondinternal electrodes 14 are connected. In this configuration, the firstexternal electrode 3 and the second dummy electrodes 15 are joined toeach other, and the second external electrode 4 and the first dummyelectrodes 13 are joined to each other. As a result, in the multilayercapacitor 1, it is possible to secure joining strength between theelement assembly 2, and the first external electrode 3 and the secondexternal electrode 4.

In the embodiment, description has been given of an aspect in which thecircuit substrate 100 of the electronic component device 110 includesthe land electrodes L1 and L2 as an example. As illustrated in FIG. 9A,a circuit substrate 100A may further include land electrodes L3 and L4.The land electrodes L3 and L4 are mounted on the substrate ST. The landelectrodes L3 and L4 are not electrically connected to the electricalcircuit. In this configuration, as illustrated in FIG. 9B, the mainsurface 2 d (mounting surface) of the element assembly 2 of themultilayer capacitor 1 is downwardly located, the electrode portion 3 cof the first external electrode 3 and the land electrode L1 are disposedto be opposite to each other, and the electrode portion 4 c of thesecond external electrode 4 and the land electrode L2 are disposed to beopposite to each other. In addition, the electrode portion 5 c of thefirst connection conductor 5 and the land electrode L3 are disposed tobe opposite to each other, and the electrode portion 6 c of the secondconnection conductor 6 and the land electrode L4 are disposed to beopposite to each other. The first external electrode 3 and the landelectrode L1 are jointed to each other with solder S1, and the secondexternal electrode 4 and the land electrode L2 are joined to each otherwith solder S2. In addition, the first connection conductor 5 and theland electrode L3 are joined with solder S3, and the second connectionconductor 6 and the land electrode L4 are joined with solder (notillustrated).

According to this, in the electronic component device, the firstexternal electrode 3 of the multilayer capacitor 1 and the landelectrode L1 are electrically connected to each other, and the secondexternal electrode 4 and the land electrode L2 are electricallyconnected to each other. That is, the first external electrode 3 and thesecond external electrode 4 of the multilayer capacitor 1 areelectrically connected to the electronic circuit (the power supply 120and the ECU 130) through the interconnections E1 and E2. In theelectronic component device, the first connection conductor 5 and thesecond connection conductor 6 are not electrically connected to theelectronic circuit of the circuit substrate 100A.

Hereinbefore, description has been given of the multilayer capacitor 1according to the first embodiment. However, the multilayer capacitor 1is not limited to the above-described aspect, and various modificationscan be made in a range not departing from the gist of the invention.

In the embodiment, description has been given of an aspect in which thefirst internal electrodes 12 and the second internal electrodes 14 aredisposed to be opposite to each other at the central portion of theelement assembly 2 in the first direction D1 as an example. However, asillustrated in FIG. 10, a pair of third internal electrodes 16 may bedisposed to be opposite to each other between the first internalelectrodes 12 and the second internal electrodes 14. In the multiplayercapacitor 1A having the above-described configuration, a capacitanceportion is not formed between the first capacitance portion C1 and thesecond capacitance portion C2. As a result, it is possible to easilyrealize a configuration in which the first capacitance portion C1 andthe second capacitance portion C2 are electrically connected in series.

As illustrated in FIG. 11, a plurality of (four in this embodiment) thethird internal electrodes 16 may be disposed between the one firstinternal electrode 12 and the one second internal electrode 14. In amultilayer capacitor 1B having this configuration, for example, even ina case where breakage of the first internal electrodes 12, whichconstitute the first capacitance portion C1, occurs, it is possible tosuppress the breakage from propagating to the second internal electrodes14, which constitutes the second capacitance portion C2, due to thethird internal electrodes 16. As a result, in the multilayer capacitor1B, even in a case where cracks occur in the element assembly 2, it ispossible to protect a part of the capacitance portions.

In the embodiment, description has been given of an aspect in which thefirst dummy electrodes 13 are disposed at the same position as that ofthe first internal electrodes 12, and the second dummy electrodes 15 aredisposed at the same position as that of the second internal electrodes14 as an example. However, the dummy electrodes may be disposed at thesame position as that of at least one side between the first internalelectrodes 12 and the second internal electrodes 14. In addition, as ina multilayer capacitor 1C illustrated in FIG. 12, third dummy electrodes17 and fourth dummy electrodes 18 may be disposed at the same positionsas in the third internal electrodes 16. In addition, at least one sidebetween the third dummy electrodes 17 and the fourth dummy electrodes 18may be disposed at the same position that of the third internalelectrodes 16. In addition, dummy electrodes may be disposed at the sameposition as that of the first internal electrodes 12, the secondinternal electrodes 14, and the third internal electrodes 16. Inaddition, the dummy electrodes may not be disposed.

In the embodiment, description has been given of an aspect in which thefirst connection conductor 5 includes the electrode portions 5 a to 5 c,and the electrode portions 5 b and 5 c are respectively disposed on thepair of main surfaces 2 c and 2 d as an example. However, as in amultilayer capacitor 1D illustrated in FIG. 13A, a first connectionconductor 5A may be disposed only on the lateral surface 2 e of theelement assembly 2. The first connection conductor 5A may be disposed tocover the entirety of a portion, which is exposed to the lateral surface2 e, of the connection portion 16 b of the third internal electrodes 16.Similarly, the second connection conductor 6A may be disposed only onthe lateral surface 2 f of the element assembly 2. The second connectionconductor 6A may be disposed to cover the entirety of a portion, whichis exposed to the lateral surface 2 f, of the connection portion 16 c ofthe third internal electrodes 16. In this configuration, as illustratedin FIG. 13B, the connection portion 16 b of the third internal electrode16 is directly connected to the first connection conductor 5A, and theconnection portion 16 c of the third internal electrode 16 is directlyconnected to the second connection conductor 6A. In this configuration,it is possible to stably mount the first external electrode 3 and thesecond external electrode 4 of the multilayer capacitor 1D on thecircuit substrate 100. In addition, it is possible to suppressshort-circuiting from occurring between the first external electrode 3and/or the second external electrode 4, and the first connectionconductor 5 and/or the second connection conductor 6.

In addition, as illustrated in FIG. 14A, in a multilayer capacitor 1E, aconnection conductor may not be disposed on an outer surface of theelement assembly 2. In this case, as illustrated in FIG. 14B, in themultilayer capacitor 1E, the connection portions 16 b (16 c) of thethird internal electrodes 16 may be electrically connected to each otherby a via-conductor 19. In this configuration, it is possible to stablymount the first external electrode 3 and the second external electrode 4of the multilayer capacitor 1E on the circuit substrate 100. Inaddition, it is possible to suppress short-circuiting from occurringbetween the first external electrode 3 and/or the second externalelectrode 4, and the first connection conductor 5 and/or the secondconnection conductor 6.

In the embodiment, description has been given of an aspect in which theplurality of first internal electrodes 12 are disposed in a region onthe main surface 2 c side, and the plurality of second internalelectrodes 14 are disposed in a region on the main surface 2 d side asan example. That is, description has been given of an aspect in whichthe first capacitance portion C1 is constructed in the region on themain surface 2 c side, and the second capacitance portion C2 isconstructed in the region on the main surface 2 d side as an example.However, the plurality of first internal electrodes 12 may be disposedin a region on the main surface 2 d side, and the plurality of secondinternal electrodes 14 may be disposed in a region on the main surface 2c side.

Second Embodiment

Subsequently, description will be given of a multilayer capacitoraccording to a second embodiment. As illustrated in FIG. 15, amultilayer capacitor 1F according to the second embodiment includes anelement assembly 2, a first external electrode 3, a second externalelectrode 4, a first connection conductor 5 (refer to FIG. 2), and asecond connection conductor 6 which are disposed on an outer surface ofthe element assembly 2.

The multilayer capacitor 1F includes a plurality of first internalelectrodes 12A, a plurality of second internal electrodes 14A, and aplurality of third internal electrodes 16 as internal conductors whichare disposed in the element assembly 2. In this embodiment, the number(here, six) of the plurality of first internal electrode 12A is the sameas the number of the plurality of second internal electrodes 14A.

The first internal electrodes 12A and the second internal electrodes 14Aare disposed at the same position (layer) of the element assembly 2 inthe first direction D1. The first internal electrodes 12A, the secondinternal electrodes 14A, and the third internal electrodes 16 arealternately disposed to be opposite to each other at an interval in thefirst direction D1 at the inside of the element assembly 2.

The plurality of first internal electrodes 12A are disposed in a regionon the one end surface 2 a side in the second direction D2 of theelement assembly 2. In this embodiment, the plurality of first internalelectrodes 12A are disposed in a region on the one end surface 2 a sideof the element assembly 2 in comparison to the central portion of theelement assembly 2 in the second direction D2.

As illustrated in FIG. 16, one end of the first internal electrodes 12Ais exposed to the one end 2 a. The other end of the first internalelectrodes 12A is spaced away from the other end of the second internalelectrodes 14A at a predetermined interval. The first internalelectrodes 12A are not exposed to the other end surface 2 b, the pair ofmain surfaces 2 c and 2 d, and the pair of lateral surfaces 2 e and 2 f.In the first internal electrodes 12A, an end exposed to the one end 2 ais electrically connected to the first external electrode 3.

The plurality of second internal electrodes 14A are disposed in a regionon the other end surface 2 b side in the second direction D2 of theelement assembly 2. In this embodiment, the plurality of second internalelectrodes 14A are disposed in a region on the other end surface 2 bside of the element assembly 2 in comparison to the central portion ofthe element assembly 2 in the second direction D2. In this embodiment,the second internal electrodes 14A have the same shape and the samedimensions as a shape and dimensions of the first internal electrodes12A.

One end of the second internal electrodes 14A is exposed to the otherend surface 2 b. The other end of the second internal electrodes 14A isspaced away from the other end of the first internal electrodes 12A at apredetermined interval. The second internal electrodes 14A is notexposed to the one end surface 2 a, the pair of main surfaces 2 c and 2d, and the pair of lateral surfaces 2 e and 2 f. In the second internalelectrodes 14, an end exposed to the other end surface 2 b iselectrically connected to the second external electrode 4.

The third internal electrodes 16 include a main electrode portion 16 a,and connection portions 16 b and 16 c. The main electrode portion 16 aare opposite to each of the first internal electrodes 12A and each ofthe second internal electrodes 14A in the first direction D1 through apart (dielectric layer 10) of the element assembly 2.

As illustrated in FIG. 17, the multilayer capacitor 1F includes a firstcapacitance portion C11 and a second capacitance portion C22. The firstcapacitance portion C11 is constituted by the first internal electrodes12A and the third internal electrodes 16 which are alternately disposedto be opposite to each other at an interval in the first direction D1 atthe inside of the element assembly 2. In this embodiment, the firstcapacitance portion C11 is constructed in a region on the one endsurface 2 a side of the element assembly 2 in comparison to the centralportion of the element assembly 2 in the second direction D2. The firstcapacitance portion C11 constitutes a first capacitor component.

The second capacitance portion C22 is constituted by the second internalelectrodes 14A and the third internal electrodes 16 which arealternately disposed to be opposite to each other at an interval in thefirst direction D1 at the inside of the element assembly 2. In thisembodiment, the second capacitance portion C22 is constructed in aregion on the other end 2 b side of the element assembly 2 in comparisonto the central portion of the element assembly 2 in the second directionD2. The second capacitance portion C22 constitutes a second capacitorcomponent.

In the multilayer capacitor 1F, a plurality of the first capacitanceportions C11 are electrically connected in parallel, and a plurality ofthe second capacitance portions C22 are electrically connected inparallel. In the multilayer capacitor 1F, the first capacitance portionsC11 and the second capacitance portions C22 are electrically connectedin series. Specifically, the first capacitance portion C11 and thesecond capacitance portion C22 are electrically connected in series bythe plurality of third internal electrodes 16 which are electricallyconnected by the first connection conductor 5 and the second connectionconductor 6. Furthermore, it is not necessary for the number of thefirst capacitance portion C11 and the second capacitance portion C22 asillustrated in FIG. 17 to be the same as the number of the firstinternal electrodes 12A, the second internal electrodes 14A, and thethird internal electrodes 16 as illustrated in FIG. 15.

As in the first embodiment, the multilayer capacitor 1F having theabove-described configuration is mounted on the circuit substrate 100including the land electrodes L1 and L2, thereby constituting anelectronic component device. As in the first embodiment, as illustratedin FIG. 8B, in the electronic component device, the main surface 2 d(mounting surface) of the element assembly 2 of the multilayer capacitor1F is downwardly located, the electrode portion 3 c of the firstexternal electrode 3 and the land electrode L1 are disposed to beopposite to each other, and the electrode portion 4 c of the secondexternal electrode 4 and the land electrode L2 are disposed to beopposite to each other. The first external electrode 3 and the landelectrode L1 are joined to each other with solder S1, and the secondexternal electrode 4 and the land electrode L2 are joined to each otherwith solder S2. According to this, in the electronic component device,the first external electrode 3 of the multilayer capacitor 1F and theland electrode L1 are electrically connected to each other, and thesecond external electrode 4 and the land electrode L2 are electricallyconnected to each other. That is, in the electronic component device,only the first external electrode 3 and the second external electrode 4of the multilayer capacitor 1F are electrically connected to theelectronic circuit (the power supply 120 and the ECU 130) through theinterconnections E1 and E2. In the electronic component device, thefirst connection conductor 5 and the second connection conductor 6 arenot electrically connected to the electronic circuit of the circuitsubstrate 100.

As described above, in the multilayer capacitor 1F of the electroniccomponent device according to this embodiment, the first capacitanceportion C11 is constituted by the first internal electrodes 12A whichare electrically connected to the first external electrode 3, and thethird internal electrodes 16, and the second capacitance portion C22 isconstituted by the second internal electrodes 14A which are connected tothe second external electrode 4, and the third internal electrodes 16.The plurality of third internal electrodes 16 are electrically connectedto each other by the first connection conductor 5 and the secondconnection conductor 6. According to this, the multilayer capacitor 1Fhas a configuration in which two capacitor components are connected inseries. As a result, in the multilayer capacitor 1F, an improvement ofthe withstand voltage property is realized.

In addition, in the multilayer capacitor 1F, since the first capacitanceportion C11 and the second capacitance portion C22 are connected inseries by the plurality of third internal electrodes 16 which areelectrically connected to each other by the first connection conductor 5and the second connection conductor 6, for example, in a case where aproblem occurs in the first capacitance portion C11, a variation occursin electrostatic capacitance and a resistance value. According to this,in the multilayer capacitor 1F, even when a problem occurs aftermounting, it is possible to detect the problem. As a result, in theelectronic component device including the multilayer capacitor 1F, it ispossible to detect occurrence of a problem while realizing animprovement of the withstand voltage property.

In addition, in the multilayer capacitor 1F, as illustrated in FIG. 17,it is possible to realize a configuration in which the first capacitanceportion C11 and the second capacitance portion C22 (two capacitorcomponents) are connected in series with one multilayer capacitor (withone chip). Accordingly, in the multilayer capacitor 1F, it is possibleto realize safety design (design capable of detecting occurrence of aproblem while realizing an improvement in a withstand voltage property)with one chip.

In the multilayer capacitor 1F of the electronic component deviceaccording to this embodiment, the first internal electrodes 12A aredisposed in a region on the one end surface 2 a side at the inside ofthe element assembly 2, and the second internal electrodes 14A aredisposed in a region on the other end surface 2 b side at the inside ofthe element assembly 2. According to this, in the multilayer capacitor1F, the first capacitance portion C11 is constructed in the region onthe one end surface 2 a side, and the second capacitance portion C22 isconstructed in the region on the other end surface 2 b side. Accordingto this, even in a case where bending occurs in the element assembly 2,and thus cracks occur in the element assembly 2 from the main surface 2c side and the main surface 2 d side, for example, the second internalelectrodes 14A disposed on the other end surface 2 b side may be broken,but it is possible to avoid breakage of the first internal electrodes12A disposed on the one end surface 2 a side. Accordingly, in themultilayer capacitor 1F, it is possible to protect the first capacitanceportion C11. As described above, in the multilayer capacitor 1F, even ina case where cracks occur in the element assembly 2, it is possible toprotect a part of the capacitance portions.

In addition, in the multilayer capacitor 1F, an area (region) in whichthe first internal electrodes 12A and the second internal electrodes14A, and the third internal electrodes 16 are opposite to each other issmall, and thus it is possible to realize a reduction in equivalentseries inductance (ESL),

Hereinbefore, description has been given of the multilayer capacitor 1Faccording to the second embodiment, but the multilayer capacitor 1F isnot limited to the above-described aspect, and various modifications canbe made in a range not departing from the gist thereof.

In the embodiment, description has been given of an aspect in which thefirst connection conductor 5 includes the electrode portions 5 a to 5 c,and the electrode portions 5 b and 5 c are respectively disposed on thepair of main surfaces 2 c and 2 d as an example. However, as in thefirst embodiment (refer to FIG. 13A and FIG. 13B), the first connectionconductor may be disposed only on the lateral surface 2 e of the elementassembly 2. The first connection conductor may be disposed to cover theentirety of a portion, which is exposed to the lateral surface 2 e, ofthe connection portion 16 b of the third internal electrodes 16.Similarly, the second connection conductor may be disposed only on thelateral surface 2 f of the element assembly 2. The second connectionconductor may be disposed to cover the entirety of a portion, which isexposed to the lateral surface 2 f, of the connection portion 16 c ofthe third internal electrode 16.

In addition, as illustrated in FIG. 18A, in a multilayer capacitor 1G, aconnection conductor may not be disposed on an outer surface of theexternal assembly 2. In this case, as illustrated in FIG. 18B, in themultilayer capacitor 1G, the main electrode portion 16 a of the thirdinternal electrodes 16 may be electrically connected to each other by avia-conductor 19A.

In the embodiment, description has been given of an aspect in which theplurality of first internal electrodes 12A are disposed in a region onthe end surface 2 a side, and the plurality of second internalelectrodes 14A are disposed in a region on the end surface 2 b side asan example. That is, description has been given of an aspect in whichthe first capacitance portion C11 is constructed in the region on theend surface 2 a side, and the second capacitance portion C22 isconstructed in the region on the end surface 2 b side as an example.However, the plurality of first internal electrodes 12A may be disposedin a region on the end surface 2 b side, and the plurality of secondinternal electrodes 14A may be disposed in a region on the end surface 2a side.

Third Embodiment

Subsequently, description will be given of a multilayer capacitoraccording to a third embodiment. As illustrated in FIG. 19, a multilayercapacitor 1H according to the third embodiment includes an elementassembly 2, a first external electrode 3, a second external electrode 4,a first connection conductor 5 (refer to FIG. 2), and a secondconnection conductor 6 which are disposed on an outer surface of theelement assembly 2.

As illustrated in FIG. 19, the multilayer capacitor 1H includes a firstcapacitance portion C1, a second capacitance portion C2, and anisolation portion D. The isolation portion D is provided between thefirst capacitance portion C1 and the second capacitance portion C2. Inthis embodiment, the isolation portion D is provided between the firstinternal electrodes 12 and the second internal electrodes 14. Theisolation portion D is constructed by laminating a dielectric layer 10.Specifically, the isolation portion D may be constituted by laminatingthe dielectric layer 10 in at least two or more layers.

In this embodiment, electric field intensity of in the isolation portionD is smaller than electric field intensity of the first internalelectrodes 12 and the third internal electrodes 16 in the firstcapacitance portion C1, and electrical field intensity of the secondinternal electrodes 14 and the third internal electrodes 16 in thesecond capacitance portion C2.

As illustrated in FIG. 19, in a case where a distance between an edge 4f, which is located on an inner side in the second direction D2, of theelectrode portion 4 c of the second external electrode 4 and the endsurface 2 b in the second direction D2 (a distance between an edge 3 f,which is located on an inner side in the second direction D2, of theelectrode portion 3 c of the first external electrode 3 and the endsurface 2 a in the second direction D2) is set as BL, and a distancebetween the main surface 2 d and the first capacitance portion C1 in thefirst direction D1 (in this embodiment, a distance between the mainsurface 2 d and the first inner electrodes 12) is set as GL, themultilayer capacitor 1H satisfies the following relationshipBL<GL×0.36

As described above, in the multilayer capacitor 1H of the electroniccomponent device according to this embodiment, the first capacitanceportion C1 is constructed by the first internal electrodes 12 which areelectrically connected to the first external electrode 3, and the thirdinternal electrodes 16, and the second capacitance portion C2 isconstructed by the second internal electrodes 14 which are connected tothe second external electrode 4, and the third internal electrodes 16.The plurality of third internal electrodes 16 are electrically connectedto each other. According to this, the multilayer capacitor 1H has aconfiguration in which two capacitor components (a first capacitorcomponent and a second capacitor component) are connected in series. Asa result, in the multilayer capacitor 1H, an improvement in thewithstand voltage property is realized. The multilayer capacitor 1Hincludes the isolation portion D that isolates the first capacitanceportion C1 and the second capacitance portion C2 from each other, andelectric field intensity in the isolation portion D is smaller thanelectric field intensity of the first internal electrodes 12 and thethird internal electrodes 16 in the first capacitance portion C1, andelectric field intensity of the second internal electrodes 14 and thethird internal electrodes 16 in the second capacitance portion C2.According to this, in the multilayer capacitor 1H, it is possible tosuppress insulation breakage and the like from occurring between thefirst capacitance portion C1 and the second capacitance portion C2. As aresult, it is possible to realize an improvement in the withstandvoltage property.

In the multilayer capacitor 1H of the electronic component deviceaccording to this embodiment, the plurality of third internal electrodes16 are electrically connected to each other by the first connectionconductor 5 and the second connection conductor 6. According to this, inthe multilayer capacitor 1H, for example, in a case where a problemoccurs in the first capacitance portion C1, a variation occurs inelectrostatic capacitance and a resistance value. As a result, in themultilayer capacitor 1H, even though a problem occurs after mounting, itis possible to detect the problem.

In the multilayer capacitor 1H of the electronic component deviceaccording to this embodiment, the first internal electrodes 12 aredisposed in a region on the one main surface 2 c side at the inside ofthe element assembly 2, and the second internal electrodes 14 aredisposed in a region on the other main surface 2 d side at the inside ofthe element assembly 2. According to this, in the multilayer capacitor1H, the first capacitance portion C1 is formed on the one main surface 2c side, and the second capacitance portion C2 is formed on the othermain surface 2 d side. According to this, in a case where the multilayercapacitor 1H is mounted in a state in which the other main surface 2 dis set as a mounting surface, even in a case where cracks occur in theelement assembly 2 from both of the first external electrode 3 side andthe second external electrode 4 side, the second internal electrodes 14may be broken, but it is possible to avoid breakage of the firstinternal electrodes 12 disposed on the one main surface 2 c side.Accordingly, in the multilayer capacitor 1H, it is possible to protectthe first capacitance portion C1. As described above, in the multilayercapacitor 1H, even in a case where cracks occur in the element assembly2, it is possible to protect a part of the capacitance portions.

In the multilayer capacitor 1H of the electronic component deviceaccording to this embodiment, in a case where the distance between theedge 3 f or 4 f, which is located on an inner side in the seconddirection D2, of the electrode portion 3 c or 4 c of the first externalelectrode 3 or the second external electrode 4, and the end surface 2 aor 2 b on which the first external electrode 3 or the second externalelectrode 4 which includes the electrode portion 3 c or 4 c is disposedis set as BL, and the distance between the main surface 2 d that is amounting surface and the first capacitance portion C1 is set as BL, thefollowing relationship is satisfied.BL<GL×0.36

As described above, in the multilayer capacitor 1H of the electroniccomponent device according to this embodiment, the first capacitanceportion C1 is constructed by the first internal electrodes 12 which areelectrically connected to the first external electrode 3, and the thirdinternal electrodes 16, and the second capacitance portion C2 isconstructed by the second internal electrodes 14 which are connected tothe second external electrode 4, and the third internal electrodes 16.The plurality of third internal electrodes 16 are electrically connectedto each other. According to this, the multilayer capacitor 1H has aconfiguration in which two capacitor components (a first capacitorcomponent and a second capacitor component) are connected in series. Asa result, in the multilayer capacitor 1H, an improvement in thewithstand voltage property is realized. The multilayer capacitor 1Hincludes the isolation portion D that isolates the first capacitanceportion C1 and the second capacitance portion C2 from each other, andelectric field intensity in the isolation portion D is smaller thanelectric field intensity of the first internal electrodes 12 and thethird internal electrodes 16 in the first capacitance portion C1, andelectric field intensity of the second internal electrodes 14 and thethird internal electrodes 16 in the second capacitance portion C2. Asshown in FIG. 19, a distance d1 between the first internal electrode 12and the third internal electrodes 16, which oppose each other in theopposing direction, and a distance d2 between the second internalelectrode 14 and the third internal electrodes 16, which oppose eachother in the opposing direction, are shorter than a width d3 of theisolation portion D in the opposing direction. According to this, in themultilayer capacitor 1H, it is possible to suppress insulation breakageand the like from occurring between the first capacitance portion C1 andthe second capacitance portion C2. As a result, it is possible torealize an improvement in the withstand voltage property.

Hereinbefore, description has been given of the multilayer capacitor 1Haccording to the third embodiment, but the multilayer capacitor 1H isnot limited to the above-described aspect, and various modifications canbe made in a range not departing from the gist thereof.

In the embodiment, description has been given of an aspect in which thefirst connection conductor 5 includes the electrode portions 5 a to 5 c,and the electrode portions 5 b and 5 c are respectively disposed on thepair of main surfaces 2 c and 2 d as an example. However, as in thefirst embodiment (refer to FIG. 13A and FIG. 13B), the first connectionconductor may be disposed only on the lateral surface 2 e of the elementassembly 2. The first connection conductor may be disposed to cover theentirety of a portion, which is exposed to the lateral surface 2 e, ofthe connection portion 16 b of the third internal electrodes 16.Similarly, the second connection conductor may be disposed only on thelateral surface 2 f of the element assembly 2. The second connectionconductor may be disposed to cover the entirety of a portion, which isexposed to the lateral surface 2 f, of the connection portion 16 c ofthe third internal electrode 16.

In addition, similar to the first embodiment (refer to FIG. 14A and FIG.14B), the connection conductor may not be disposed on the outer surfaceof the element assembly 2.

In the embodiment, description has been given of an aspect in which theisolation portion D is provided between the first internal electrodes 12and the second internal electrodes 14 as an example. However, asillustrated in FIG. 20, the isolation portion D may be provided betweena pair of the third internal electrodes 16 which are opposite to eachother in the first direction D1. In a multilayer capacitor 1I havingthis configuration, the isolation portion D is disposed between thethird internal electrodes 16 which are electrically connected to eachother, and thus electric field intensity at the isolation portion can beset to “zero”. Accordingly, in the multilayer capacitor 1I, it ispossible to further suppress insulation breakage and the like fromoccurring between the first capacitance portion C1 and the secondcapacitance portion C2. As a result, it is possible to further realizean improvement in the withstand voltage property.

In the embodiment, description has been given of an aspect in which theisolation portion D is constructed by laminating a plurality of thedielectric layers 10 as an example. However, the configuration of theisolation portion is not limited thereto. For example, the isolationportion may be constructed by forming a portion, in which the isolationportion is provided in the element assembly, with a material havingspecific dielectric constant smaller than that of a dielectric materialof the dielectric layer 10.

Hereinbefore, description has been given of the embodiments of theinvention, but the invention is not limited to the embodiments, andvarious modifications can be made in a range not departing from the gistof the invention.

In the embodiments, description has been given of an aspect in which theelectrode portion 3 c of the first external electrode 3 and the landelectrode L1 are disposed to be opposite to each other, the electrodeportion 4 c of the second external electrode 4 and the land electrode L2are disposed to be opposite to each other, the first external electrode3 and the land electrode L1 are joined to each other with solder S1, andthe second external electrode 4 and the land electrode L2 are joined toeach other with solder S2 as an example. However, the first externalelectrode 3 and the land electrode L1 may be electrically connected toeach other, for example, through a metal terminal having an L-shape.Similarly, the second external electrode 4 and the land electrode L2 maybe electrically connected to each other through the metal terminal.

In the embodiments, description has been given of an aspect in which thefirst internal electrodes 12 and 12A, the second internal electrodes 14and 14A, and the third internal electrodes 16 are perpendicular to thelateral surfaces 2 e and 2 f of the element assembly 2 which aremounting surfaces, and extend along an opposing direction of the pair ofend surfaces 2 a and 2 b as an example. That is, description has beengiven of an aspect in which a lamination direction of the dielectriclayer 10 is the opposing direction of the pair of main surfaces 2 c and2 d as an example. However, the first internal electrode, the secondinternal electrode, and the third internal electrode may beperpendicular to the main surfaces 2 c and 2 d of the element assembly2, and may extend along the opposing direction of the pair of endsurfaces 2 a and 2 b.

In the embodiments, description has been given of an aspect in which thefirst external electrode 3 includes the electrode portions 3 a and 3 eas an example. However, the first external electrode 3 may include atleast the electrode portions 3 a and 3 c. Similarly, the second externalelectrode 4 may include at least the electrode portions 4 a and 4 c.

In the embodiments, description has been given of an aspect in which theelectronic component device includes the multilayer capacitor as anexample. However, the invention may be only the multilayer capacitor.

What is claimed is:
 1. A multilayer capacitor, comprising: an elementassembly including a pair of end surfaces which are opposite to eachother, a pair of main surfaces which are opposite to each other, and apair of lateral surfaces which are opposite to each other; a firstexternal electrode and a second external electrode which arerespectively disposed on pair-of-end-surface sides; and a plurality ofinternal electrodes which are disposed in the element assembly, theplurality of internal electrodes including: a first internal electrodethat is electrically connected to the first external electrode; a secondinternal electrode that is electrically connected to the second externalelectrode; and a plurality of third internal electrodes that areelectrically connected to each other by a connection conductor disposedon an outer surface of the element or a via conductor disposed in theelement; a first capacitance portion that is constituted by the firstinternal electrode and the third internal electrodes which are disposedin a region on one main surface side at an inside of the elementassembly; a second capacitance portion that is constituted by the secondinternal electrode and the third internal electrodes which are disposedin a region on the other main surface side at the inside of the elementassembly; and an isolation portion that is provided between the firstcapacitance portion and the second capacitance portion in an opposingdirection of the pair of main surfaces to isolate the first capacitanceportion and the second capacitance portion, wherein electric fieldintensity at the isolation portion is smaller than electric fieldintensity of the first internal electrode and the third internalelectrodes at the first capacitance portion, and electric fieldintensity of the second internal electrode and the third internalelectrodes at the second capacitance portion.
 2. The multilayercapacitor according to claim 1, wherein a distance between the firstinternal electrode and the third internal electrodes, which oppose eachother in the opposing direction, and a distance between the secondinternal electrode and the third internal electrodes, which oppose eachother in the opposing direction, are shorter than a width of theisolation portion in the opposing direction.
 3. The multilayer capacitoraccording to claim 1, wherein the other main surface of the elementassembly is a mounting surface, each of the first external electrode andthe second external electrode includes an electrode portion that isdisposed on the mounting surface, and when a distance between an edge,which is located on an inner side in an opposing direction of the pairof end surfaces, of the electrode portion of each of the first externalelectrode and the second external electrode, and an end surface, onwhich the first external electrode or the second external electrode thatincludes the electrode portion is disposed, in the pair of end surfacesis set as BL, and a distance between the mounting surface and the firstcapacitance portion is set as GL, a relationship of BL<GL×0.36 issatisfied.
 4. An electronic component device, comprising: a circuitboard including an electrical circuit; and a multilayer capacitormounted on the circuit board, the multilayer capacitor comprising: anelement assembly including a pair of end surfaces which are opposite toeach other, a pair of main surfaces which are opposite to each other,and a pair of lateral surfaces which are opposite to each other; a firstexternal electrode and a second external electrode which arerespectively disposed on pair-of-end-surface sides; and a plurality ofinternal electrodes which are disposed in the element assembly, theplurality of internal electrodes including: a first internal electrodethat is electrically connected to the first external electrode; a secondinternal electrode that is electrically connected to the second externalelectrode; and a plurality of third internal electrodes that areelectrically connected to each other by a connection conductor disposedon an outer surface of the element or a via conductor disposed in theelement; a first capacitance portion that is constituted by the firstinternal electrode and the third internal electrodes which are disposedin a region on one main surface side at an inside of the elementassembly; a second capacitance portion that is constituted by the secondinternal electrode and the third internal electrodes which are disposedin a region on the other main surface side at the inside of the elementassembly; and an isolation portion that is provided between the firstcapacitance portion and the second capacitance portion in an opposingdirection of the pair of main surfaces to isolate the first capacitanceportion and the second capacitance portion, wherein electric fieldintensity at the isolation portion is smaller than electric fieldintensity of the first internal electrode and the third internalelectrodes at the first capacitance portion, and electric fieldintensity of the second internal electrode and the third internalelectrodes at the second capacitance portion.
 5. The electroniccomponent device according to claim 4, wherein the isolation portion isdisposed between a pair of third internal electrodes which are oppositeto each other in the opposing direction.
 6. The electronic componentdevice according to claim 4, wherein the connection conductor connectsthe plurality of third internal electrodes, the other main surface ofthe element assembly is a mounting surface, the connection conductor isdisposed on pair-of-lateral-surface sides of the element assembly, eachof the first external electrode, the second external electrode, and theconnection conductor includes an electrode portion that is disposed onthe mounting surface, and a thickness of the electrode portion of theconnection conductor in the opposing direction is smaller than athickness of the electrode portion of each of the first externalelectrode and the second external electrode in the opposing direction.7. The electronic component device according to claim 6, wherein when adistance between an edge, which is located on an inner side in anopposing direction of the pair of end surfaces, of the electrode portionof each of the first external electrode and the second externalelectrode, and an end surface, on which the first external electrode orthe second external electrode that includes the electrode portion isdisposed, in the pair of end surfaces is set as BL, and a distancebetween the mounting surface and the first capacitance portion is set asGL, a relationship of BL<GL×0.36 is satisfied.
 8. The multilayercapacitor according to claim 1, wherein the isolation portion isdisposed between a pair of third internal electrodes which are oppositeto each other in the opposing direction.
 9. The multilayer capacitoraccording to claim 1, wherein a distance between the first internalelectrode and the third internal electrodes, which oppose each other inthe opposing direction, and a distance between the second internalelectrode and the third internal electrodes, which oppose each other inthe opposing direction, are shorter than a distance in the opposingdirection between the first internal electrode and the second internalelectrode.
 10. The multilayer capacitor according to claim 1, whereinthe connection conductor connects the plurality of third internalelectrodes, the other main surface of the element assembly is a mountingsurface, the connection conductor is disposed on pair-of-lateral-surfacesides of the element assembly, each of the first external electrode, thesecond external electrode, and the connection conductor includes anelectrode portion that is disposed on the mounting surface, and athickness of the electrode portion of the connection conductor in theopposing direction is smaller than a thickness of the electrode portionof each of the first external electrode and the second externalelectrode in the opposing direction.
 11. The multilayer capacitoraccording to claim 1, wherein the first capacitance portion and thesecond capacitance portion are electrically connected in series.